High efficiency Module 

         

Before using module
 
 

                       

After using module


 


The liquid cooling module is composed of  the boiling plate, which absorbs high heat flux and reduces thermal spreading resistance, and the condenser plate, which condensates vapor and cools liquid. 

Condenser Plate


Expansion of cooling area
Route of bubble

Boiling Plate

Expansion of boiling area
Surface Enhancement
Use of pin fin
 Microporous coating on fins

 
For more information, please contact:

Dr. S. M. You
Department of Mechanical and Aerospace Engineering
The University of Texas at Arlington
Box 19023
Arlington, TX 76019-0023
Phone: (817) 272-5635
Fax: (817) 272-2952
E-Mail: you@uta.edu
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